full flex pcb effect diagram

HD-OO1	HD-002	HD-003	HD-004
HD-005	HD-006	HD-007	HD-008
HD-009	HD-010	HD-011	HD-012

 

Technical Specification

Scope of products : Single-side FPC, double-side FPC, multilayer FPC, aluminum substrate, copper substrate, single-side hollowed-out FPC and double-side hollowed-out FPC

Thinnest substrate : Copper foil/PI film: 18/12.5 um 12/18um

Smallest wire width and distance : 0.05mm/0.05mm (2mil/2mil)

Smallest aperture : 0.25mm (10mil)

Resistance to flexural cracking : > 150,000 cycles

Etching tolerance : ± 0.5 mil

Tolerance for exposure and alignment : ± 0.05mm (2mil)

Tolerance for projection punching : ± 0.025mm (1mil)

Tolerance for PI film alignment : < 0.10mm (4mil)

Tolerance for reinforcing and take alignment : < 0.1mm (4mil)

Maximum processing area : 25cm × 60cm for double side; 25 cm × 10000cm for single side; 25cm × 60cm for multilayer

Forming tolerance : ± 0.05mm

Mode of surface treatment :

Electroplated guiding : 1-5u "

Chemical gilding : 1-3u "

Pure electroplating tine : 4-20u "

Chemical tin : 1-5u "

Antioxidatio n (OSP) 6-13u"

 

 

 

Plant

HD-001 HD-002 HD-003 HD-004 HD-005 HD-006 HD-007 HD-008

 

 

The production process : full flex pcb