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Aluminum Based-PCB
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Description and 
					Application
					   Aluminum base copper-clad 
					laminate have excellent flame retardant,high 
					mechanical strength,dimensional 
					stability etc. Especially it has very good heat sink,electromagnetic 
					shielding and solder float.
					   It’s 
					widely used for the modifier and sparker on fire for 
					motorcycle and mobile,power LED,sound 
					box, power supply module and 
					acoustics shielding system etc. 
					   Note:HUADING 
					specially produces Metal Base Copper-Clad Laminates,and 
					our products have been compiled series with all complete 
					specifications. 
					●The type and specification of 
					Aluminum based Laminates HDAL-01,HDAL-04-A,HDAL-05etc.and 
					0.8mm , 1.0mm , 1.5mm , 2.0mm , 3.0mm etc. ● 
					thickness of the copper:18um,35um,70um,105um,140um..
					Base size: 330mm by 380mm (13〞by 
					15〞); 500mm ×
					600mm (20〞×24〞);
					380mm × 660mm
					(15〞×26〞)
					HD-MC04 Aluminum-based PCB Technical Data sheet
					
					Test base : 
					HD-MC04 Aluminum-based PCB
					Thickness of copper:35um
					Dielectric layer : 120um-130um
					Cu base: 1.6mm 
					The result of the test:
| 
							 No  | 
							
							 Test item  | 
							
							 U.  | 
							
							 Assay  | 
						|
| 
							 1  | 
							
							 Peel Strength  | 
							
							 A  | 
							
							 N/mm  | 
							
							 1.5  | 
						
| 
							 After thermal stress(260℃)  | 
							
							 N/mm  | 
							
							 1.3  | 
						||
| 
							 2  | 
							
							 Blister test After Thermal stress  | 
							
							 /  | 
							
							 (288℃,2min) No Delamination,No blister  | 
						|
| 
							 3  | 
							
							 Thermal resistance  | 
							
							 ℃/W  | 
							
							 0.45  | 
						|
| 
							 4  | 
							
							 Thermal-conductive Factor  | 
							
							 W/m·k  | 
							
							 2.2  | 
						|
| 
							 5  | 
							
							 Flammability(A)  | 
							
							 /  | 
							
							 FV-0  | 
						|
| 
							 6  | 
							
							 Surface Resistivity  | 
							
							 A  | 
							
							 MΩ 
  | 
							
							 3.68×107  | 
						
| 
							 Constant humidity treatment(25℃~65℃, RH:90%~98%,20 circulate)  | 
							
							 3.39×106  | 
						|||
| 
							 7  | 
							
							 Volume Resistivity  | 
							
							 A  | 
							
							 MΩ 
  | 
							
							 4.2×108  | 
						
| 
							 Constant humidity treatment(25℃~65℃, RH:90%~98%,20 circulate)  | 
							
							 3.17×107  | 
						|||
| 
							 8  | 
							
							 Dielectric Breakdown AC(leakage 5mA)  | 
							
							 KV  | 
							
							 6  | 
						|
| 
							 9  | 
							
							 Dielectric constant(1MHZ)(40℃,93%,96h)  | 
							
							 /  | 
							
							 4.24  | 
						|
| 
							 10  | 
							
							 Dielectric dissipation factor (1MHZ)(40℃,93%,96h)  | 
							
							 /  | 
							
							 0.03  | 
						|
| 
							 11  | 
							
							 CTI  | 
							
							 V  | 
							
							 600  | 
						|
| 
							 12  | 
							
							 Operating Breakdown (AC)  | 
							
							 V  | 
							
							 500  | 
						|
| 
							 13  | 
							
							 Glass transition  | 
							
							 ℃  | 
							
							 125  | 
						|
| 
							 14  | 
							
							 Thickness  | 
							
							 um  | 
							
							 120  | 
						|
Method Description
1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470 4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014 8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010
Note: For applications with an expected voltage over 480 Volts AC, HUADING recommends a dielectric thickness greater than 0.003”(76um)
Note: Maximum test voltage is a function of material and circuit design.Typical proof test not represent the maximum.
Note: Circuit design is the most important consideration for determining safety agency compliance.
HD-MC06 Aluminum-based PCB Technical Data sheet
					Test base : 
					HD-MC06 Aluminum-based PCB
					Thickness of the copper:35um
					Dielectric layer:120um-130um
					Thickness of the aluminum-base: 1.6mm
					
					The result of the test: 
| 
							 No  | 
							
							 Test item  | 
							
							 U.  | 
							
							 Assay  | 
						|
| 
							 1  | 
							
							 Peel strength  | 
							
							 A  | 
							
							 N/mm  | 
							
							 1.4  | 
						
| 
							 After thermal stress(260℃)  | 
							
							 N/mm  | 
							
							 1.2  | 
						||
| 
							 2  | 
							
							 Blister test After Thermal stress  | 
							
							 /  | 
							
							 (300℃,2min) No Delamination, No Blister  | 
						|
| 
							 3  | 
							
							 Thermal resistance  | 
							
							 ℃/W  | 
							
							 0.4  | 
						|
| 
							 4  | 
							
							 Thermal-conductive Factor  | 
							
							 W/m·k  | 
							
							 2.5  | 
						|
| 
							 5  | 
							
							 Flammability(A)  | 
							
							 /  | 
							
							 FV-0  | 
						|
| 
							 6  | 
							
							 Surface Resistivity  | 
							
							 A  | 
							
							 MΩ 
  | 
							
							 3.5×107  | 
						
| 
							 Constant humidity treatment(25℃~65℃, RH:90%~98%,20 circulate)  | 
							
							 3.38×106  | 
						|||
| 
							 7  | 
							
							 Volume Resistivity  | 
							
							 A  | 
							
							 MΩ 
  | 
							
							 4.3×108  | 
						
| 
							 Constant humidity treatment(25℃~65℃, RH:90%~98%,20 circulate)  | 
							
							 3.2×107  | 
						|||
| 
							 8  | 
							
							 Dielectric Breakdown AC(leakage 5mA)  | 
							
							 KV  | 
							
							 6  | 
						|
| 
							 9  | 
							
							 Dielectric constant (1MHZ)(40℃,93%,96h)  | 
							
							 /  | 
							
							 4.1  | 
						|
| 
							 10  | 
							
							 Dielectric dissipation factor (1MHZ)(40℃,93%,96h)  | 
							
							 /  | 
							
							 0.031  | 
						|
| 
							 11  | 
							
							 CTI  | 
							
							 V  | 
							
							 600  | 
						|
| 
							 12  | 
							
							 Operating Breakdown (AC)  | 
							
							 V  | 
							
							 500  | 
						|
| 
							 13  | 
							
							 Glass transition  | 
							
							 ℃  | 
							
							 130  | 
						|
| 
							 14  | 
							
							 Thickness  | 
							
							 Um  | 
							
							 120  | 
						|
Method Description
1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470 4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014 8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010
Note: For applications with an expected voltage over 480 Volts AC,HUADING recommends a dielectric thickness greater than 0.003”(76um)
Note: Maximum test voltage is a function of material and circuit design.Typical proof test not represent the maximum.
Note: Circuit design is the most important consideration for determining safety agency compliance.
Plant
 Aluminum Based-PCB Ordinary plate flow 
  |