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Aluminum Based-PCB

click me : Aluminum base pcb effect diagram

Description and Application
   Aluminum base copper-clad laminate have excellent flame retardanthigh mechanical strengthdimensional stability etc. Especially it has very good heat sinkelectromagnetic shielding and solder float.
   Its widely used for the modifier and sparker on fire for motorcycle and mobilepower LEDsound box power supply module and acoustics shielding system etc.
   NoteHUADING specially produces Metal Base Copper-Clad Laminatesand our products have been compiled series with all complete specifications.
The type and specification of Aluminum based Laminates HDAL-01,HDAL-04-A,HDAL-05etc.and 0.8mm , 1.0mm , 1.5mm , 2.0mm , 3.0mm etc. thickness of the copper:18um,35um,70um,105um,140um..
Base size: 330mm by 380mm (13
by 15); 500mm × 600mm (20〞×24)
380mm
× 660mm (15〞×26)


HD-MC04 Aluminum-based PCB Technical Data sheet

Test base :
HD-MC04 Aluminum-based PCB
Thickness of copper:35um
Dielectric layer : 120um-130um
Cu base: 1.6mm
The result of the test

No

Test item

U.

Assay

1

Peel Strength

A

N/mm

1.5

After thermal stress(260℃)

N/mm

1.3

2

Blister test After Thermal stress

(288℃,2min)

No Delamination,No blister

3

Thermal resistance

℃/W

0.45

4

Thermal-conductive Factor

W/m·k

2.2

5

Flammability(A)

FV-0

6

Surface Resistivity

A

 

3.68×107

Constant humidity treatment(25℃~65℃,

RH:90%~98%,20 circulate)

3.39×106

7

Volume Resistivity

A

 

4.2×108

Constant humidity treatment(25℃~65℃,

RH:90%~98%,20 circulate)

3.17×107

8

Dielectric Breakdown AC(leakage 5mA)

KV

6

9

Dielectric constant(1MHZ)(40℃,93%,96h)

4.24

10

Dielectric dissipation factor (1MHZ)(40℃,93%,96h)

0.03

11

CTI

V

600

12

Operating Breakdown (AC)

V

500

13

Glass transition

125

14

Thickness

um

120

Method Description

1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470 4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014 8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010

Note: For applications with an expected voltage over 480 Volts AC, HUADING recommends a dielectric thickness greater than 0.003”(76um)

Note: Maximum test voltage is a function of material and circuit design.Typical proof test not represent the maximum.

Note: Circuit design is the most important consideration for determining safety agency compliance.

 

HD-MC06 Aluminum-based PCB Technical Data sheet


Test base :
HD-MC06 Aluminum-based PCB
Thickness of the copper
35um
Dielectric layer:120um-130um
Thickness of the aluminum-base: 1.6mm

The result of the test

No

Test item

U.

Assay

1

Peel strength

A

N/mm

1.4

After thermal stress260℃)

N/mm

1.2

2

Blister test After Thermal stress

300℃,2min

No Delamination, No Blister

3

Thermal resistance

/W

0.4

4

Thermal-conductive Factor

W/m·k

2.5

5

FlammabilityA

FV-0

6

Surface Resistivity

A

 

3.5×107

Constant humidity treatment25℃~65℃,

RH90%98%20 circulate

3.38×106

7

Volume Resistivity

A

 

4.3×108

Constant humidity treatment25℃~65℃,

RH90%98%20 circulate

3.2×107

8

Dielectric Breakdown ACleakage 5mA

KV

6

9

Dielectric constant 1MHZ)(40℃,93%96h

4.1

10

Dielectric dissipation factor 1MHZ)(40℃,93%96h

0.031

11

CTI

V

600

12

Operating Breakdown (AC)

V

500

13

Glass transition

130

14

Thickness

Um

120

Method Description

1- Optical 2- Internal TO-220 test RD2018 3- Calculation from ASTM 5470 4-Extended ASTM 5470 5-ASTM D149 6-ASTM D150 7-Internal MDSC test RD2014 8-UL 746E 9-ASTM D2861 10- CPCA 4105-2010

Note: For applications with an expected voltage over 480 Volts AC,HUADING recommends a dielectric thickness greater than 0.003”(76um)

Note: Maximum test voltage is a function of material and circuit design.Typical proof test not represent the maximum.

Note: Circuit design is the most important consideration for determining safety agency compliance.

 

Plant

HD-001
HD-002
HD-003
HD-004
HD-005

Aluminum Based-PCB Ordinary plate flow